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ChipPub

Meng Li

Share at least one chip/semiconductor industry analysis or technical practice every day.

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Substack
PricingOnly paid issuesPublishesDaily
Issues376Foundeda year agoLast Issue24 hours ago
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Latest Issues

Hybrid Bonding, Delayed Again?

Samsung and SK Hynix face hybrid bonding delays for HBM due to falling demand for thinning and heat benefits, though future I/O growth may revive adoption.

Samsung Electronics and SK Hynix are facing increasingly significant challenges in...

24 hours ago
7
Paid

The World Has Long Suffered from DRAM

DRAM prices are skyrocketing. Discover how AMD, Apple, Marvell, and Sandisk are using AI, CXL, and flash to beat the memory crisis.

Currently, data centers are facing a new crisis—not insufficient computing power, but prohibitively expensi...

2 days ago
4
Paid

The $100B CPU Poker Game in the AI Era

Server CPU market hits $120B+ by 2030 as Agentic AI flips CPU-GPU ratios. x86 vs Arm race intensifies.

The AI industry is undergoing a fundamental shift in computing logic: moving away from the “GPU-only” paradigm centered on large model t...

4 days ago
5
Paid

Samsung Foundry Has Decided to Take Orders

Samsung Foundry adopts order allocation amid AI chip boom, prioritizing key clients and raising utilization as 4nm capacity nears full booking through 2026.

According to Korean media citing industry insiders, Samsung Electronics’ foundry d...

5 days ago
4
Paid

EUV Lithography Faces a New Challenger!

ASML's new High NA EUV lithography machine costs 400 million dollars and faces bold startups challenging its chipmaking monopoly.

Jos Benschop is climbing a ladder to reach the top of his latest machine.

6 days ago
2
Paid

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  • Meng Li

    AI Engineer, Apache Linkis Committer, and Trader sharing daily industry analysis and technical insights.

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