Ted Yu
EE Master's degree holder. 30+ years of extensive experience in telecom and high-speed data (BB CPE, 5G Wireless). Focused on high-speed communication solutions for data centers and telecom, with interest in advanced process and packaging now.
| Platform |  | Pricing | Only free issues | Publishes | Weekly |
|---|---|---|---|---|---|
| Issues | 69 | Founded | a year ago | Last Issue | 8 days ago |
| Active | |||||
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EP68. 解讀 OCP 2026 OIF CEI-448G 高速互連關鍵技術
隨著生成式 AI 叢集與大型加速器對運算頻寬的渴求呈指數級增長，Scale-up 與 Scale-out 網路架構正承受前所未有的吞吐壓力。回顧高速 SerDes 演進史，通道傳輸速率翻倍的開發週期已從過去的 5 至 6 年急劇壓縮至 3 年以內。當產業剛完成 224G 世代的技術鋪設，邁向單通道 448 Gbps 的標準制定與工程落地便已迫在眉睫。
在高速互連領域扮演先鋒偵察角色的 OIF（Optical Internetworking Forum），近年來持續推進 CE...
EP67. 解讀 OCP 2026 CPX/XPO/OCI 協議與 NPO 標準化進展
隨著 AI 模型參數規模與運算叢集持續爆發，傳統以單機櫃為核心的運算範式正邁向跨機架（Multi-Rack）乃至跨排（Multi-Row）的 Scale-Up 架構。在單通道 SerDes 速率邁向 224G 與 448G 的節點上，銅線傳輸面臨嚴峻的通道損耗斷崖（Channel Loss Cliff）、粗重線徑與散熱阻礙，驅使高速互連全面由銅走向光學架構。
為應對這場傳輸典範轉移，產業在 OFC 2026 期間同天宣告成立了涵蓋 XPO、Open CPX 與 OCI 的三...
EP66. 從材料到AI 晶片的解決方案——解析AGC的 玻璃基板、特殊材料與光波導
隨著生成式 AI 模型的參數規模呈幾何級數擴展，運算加速晶片對算力密度、高頻寬記憶體（HBM）容量以及晶粒間互連頻寬的需求急劇攀升。為了突破先進製程在物理微縮與光罩尺寸上的限制，半導體架構全面朝向 2.5D/3D 小晶片（Chiplet）異質整合與晶圓級系統（System-on-Wafer, SoW）演進。中介層封裝面積正由現行 3.3 倍光罩向 8 倍乃至 14 倍光罩以上持續延伸。
然而，在大尺寸高密度封裝的發展路徑上，傳統有機載板正面臨難以克服的物理瓶頸：
Than...
EP65. 突破記憶體牆的晶圓級運算革新：從 Cerebras WSE 到 CS-4 機架級推論架構分析
在生成式 AI 推論架構的演進中，提示處理（Prefill）與逐字生成（Decode）兩個階段展現了截然不同的物理運算特性：Prefill 階段屬於高度算力密集的矩陣乘法（Compute-Bound GEMM），高度依賴稠密算力與大容量 HBM 處理長上下文；而自迴歸逐字輸出的 Decode 階段則屬於極度頻寬受限的矩陣-向量運算（Memory Bandwidth-Bound GEMV），傳統 GPU 往往因受困於記憶體牆（Memory Wall）而導致算力大幅閒置。
面對...
EP64. HBM 技術演進與次世代整合藍圖
在大型語言模型（LLM）的擴展定律（Scaling Law）與屋頂線模型（Roofline Model）相互推動下，生成式 AI 的運算瓶頸已轉向資料傳輸端。特別是在自回歸生成的 Decode 階段，模型權重與龐大 KV Cache 的頻繁搬移，使運算強度大幅降低，系統深陷記憶體受限（Memory-Bound）的物理邊界。面對光罩極限（Reticule Limit）與片上 SRAM 微縮趨緩帶來的成本壁壘，具備 2.5D/3D 先進封裝與極高頻寬密度的高頻寬記憶體（High...
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Authors
The writers behind this newsletter.
EE Master's degree holder. 30+ years of extensive experience in telecom and high-speed data (BB CPE, 5G Wireless). Focused on high-speed communication solutions for data centers and telecom, with interest in advanced process and packaging.
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