
Expert-driven interdisciplinary deep-dives into the AI HW Infrastructure stack from pure fundamentals
| Platform | Pricing | Freemium | Publishes | Weekly | |
|---|---|---|---|---|---|
| Issues | 35 | Founded | 9 months ago | Last Issue | 9 days ago |
| Active | |||||

A system breakdown of challenges for every technology component of CPO: packaging, PIC, laser, and EIC
Quick Housekeeping Note: I’ll be a media partner for IMAPS and SiPh Symposium in Boston, MA from Sept 28 - Oct 2. The theme is “Intellig...
An advanced co-design deep dive from fundamentals to 3D integration
In this advanced deep dive, I will discuss the challenges of scaling HBM performance.
Begin with the end goal in mind: how user experience defined the architecture and how agentic coding methods contributed to the shortened chip design timeline
At the end of the Hot Chips 2026 conference, OpenAI presented their chip archite...
This post is written to give system-context for the high-speed interconnect of AI rack architectures in preparation for Hot Interconnects and Hot Chips 2026.
In part 1, I provide an overview of the network architecture:
Fundamentals of SRAM and how SRAM constraints affect array size scaling and LLM inference performance
In this post I will cover the following topics on SRAM:
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The writers behind this newsletter.
Deep-Tech Semiconductor Analyst, MSEE. Educating engineers on the complete AI datacenter hardware stack from pure fundamentals.
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